PCB Conformal Coating
PCB Conformal Coating
Arizona Rework Solutions specializes in many areas of PCB conformal coating. Conformal coating protects the electrical components in the Printed Circuit Boards from debris, and various types of environmental hazards. As well as aggressive chemicals.
Arizona Rework Solutions takes pride in their workman ship, and delivers the finest quality product available. With more than 20 years experience in the Mil-I-46058C and IPC-CC-830 standards, it's a no wonder our work speaks for itself.
Conformal Coating Engineer is NASA-STD-8739.1 Certified
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Arizona Rework Solutions takes pride in their customers and their workmanship. Feel free to learn about all of the other services we have to offer by clicking the link below.
Types of Conformal Coating
Acrylic
Urethene
Urethene
Arizona Rework Solutions uses fast drying Acrylic to protect their electronic components. Our product offers offers excellent flexibility, electrical properties, and fluoresces under UV light to aid inspection. It can be applied by spraying, brushing, or dipping methods.
Urethene
Urethene
Urethene
ARS uses the finest urethan products around. This urethane contains no free isocyanates and fluoresces under ultraviolet light for inspection purposes. It's also MIL-I-46058C and IPC-CC-830 qualified. Not to mention it's recognized under the component program of Underwriters Laboratory.
Silicone
Urethene
Chip Shield
Our HumiSeal Silicone for Conformal Coating is a one component, fast thermal curing, low viscosity coating that is flexible, VOC-free, and has a long pot life. It fluoresces under UV light to aid inspection and can be used by spraying, brushing, or dipping methods.
Chip Shield
BGA & CSP Underfill
Chip Shield
Chip shielding enhances the lifetime of our customers products. ARS goes to great lengths to ensure the reliability of our customers products. For many products in the medical, aerospace, and other industries, longterm reliability is of extreme importance.
Bonding
BGA & CSP Underfill
BGA & CSP Underfill
Our Bonding solution is a very flexible adhesive formula which provides strong, permanent bonding even under vibration and impact. Provides high shear and peel strength on metals and plastics.
BGA & CSP Underfill
BGA & CSP Underfill
BGA & CSP Underfill
We offer solutions for second-level underfill for BGAs, CSPs, or Pops, as well as no-flow underfill and jetting encapsulation technologies.